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BEGEL 8018#2 two component soft polyurethane potting gel

  • Low viscosity, strong operability
  • Excellent low temperature characteristics, excellent weather resistance
  • Excellent electrical insulation, stability
  • Good waterproof, moistureproof, very low water absorption

BEPU 8018 is a two-component-free-free room temperature or a heat-curable polyurethane gel for two-component sealing and filling. The raw material does not contain heavy metals, green environmental protection, wide process, high finished physical properties, and good binding properties. The room temperature and heating curing can be deeply cured, and the two groups have a good fluidity after mixing, the hardness is extremely low, the flexibility is excellent, and the low temperature resistance is excellent. It is used in communication equipment, transformers, control power, ignition Pouring and potting of controllers, electronic sensors, etc.

Test items Unit and condition Test standard BEPU 8018#2 A / B
Appearance A Visual Visual Yellow transparent fluid
B Visual Yellow transparent fluid
 

Viscosity

A  

25℃ mPa·s

GB/T 10247-2008 400±200
B GB/T 10247-2008 400±200
A+B GB/T 10247-2008 400±200
 

Density

A  

25℃ g/cm3

GB/T 15223-1994 1.00±0.05
B GB/T 15223-1994 0.95±0.05
A+B GB/T 15223-1994 1.00±0.05
Operating time 25℃, minutes, 150g,

Viscosity up to 100,000cps

 

GB/T 10247-2008

 

40~60

Gel time 25℃hrs GB/T 10247-2008 1~2
Mixed ratio Weight ratio —- A :B=100 :100
Curing condition ℃/h —- 25℃/ 24 h or 70℃/2h

 

 

Characteristics after curing

 

Items Unit and condition Test standard 8018(2#)
Color Visual Visual Yellow transparent
Hardness Shore 00 GB/T 4985—2010 30±10
Water absorption rate 24hrs, 25℃,% GB/T 8810-2005 <0.02
Thermal Conductivity W/m.K GB/T10297-1998 0.10
Glass transition temperature Tg GBT 11998-1989 -70
Volume resistivity 25℃,Ω·cm GB/T 1692-92 2.5*1014
Dielectric strength 25℃,kV/mm GB/T 1695-2005 >25
Dielectric constant 50Hz,25℃ GB/T 1693-2007 2.7
Dielectric loss 50Hz,25℃ GB/T 1693-2007 0.002
Linear thermal expansion μm/(m,℃) GBT 20673-2006 230
Application temperature GBT 20028-2005 -80~120

* Note: The above performance data is a typical data of the product at a humidity of 70% and a temperature of 25 ° C. It is not possible to fully guarantee all the data that can be achieved in a particular environment. Please use the measured data when you please use it.

It is used in communication equipment, transformers, control power, ignition Pouring and potting of controllers, electronic sensors, etc.

How to use:

  • Use: The raw material of material A contains functional resin, before taking the material, pay attention to the detection package is intact. After the filler is completed, it is sealed to prevent the original packaging to prevent excess of moisture. After the rubber is exposed to the air time, it may cause the AB material to bubbling the phenomenon.
  • Operation: B material is exposed to water absorption in the atmosphere, and the phenomenon is turbid until agglomeration, and the A material also needs to be stored, so as not to solidify excessive bubbles. The environment in which the curing process needs to control the humidity as low as possible, and the relative humidity should not exceed 60%.
  • Preheat: The cast device is taken from 70 to 80 ° C for 1 to 2 hours. It can also reduce the temperature to extend the heating time to remove the device moisture.
  • Defoulating: Vacher for A \ B buckets, simultaneously, to ensure that the A \ B glue is vacuum-free.
  • Pouring: Put the mixture into the device through a static mixer, the gel time is approximately within 360 mins.
  • Curing: 25 ° C / 24 hrs. The environmental humidity should be controlled at <70%, and the temperature is low to extend the curing time as appropriate.

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